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Saint-Mard+Michel+

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See detailInnovative smart sensors to enhance eco-efficiency of a continuous (steel) production line
Saint-Mard, Michel; Stoukatch, Serguei ULg; Schischke, Karsten et al

in Proc. Conf. of the AMA Association for Sensor Technology (2013, May 15)

The paper aims to demonstrate the benefits for a global approach that allows to define new research directions, new potential industrial markets, and increasing interest from potential users. Combining ... [more ▼]

The paper aims to demonstrate the benefits for a global approach that allows to define new research directions, new potential industrial markets, and increasing interest from potential users. Combining performance, economic and environmental criteria in a joint assessment approach for the target applications of sensor systems, facilitates significantly the communication between service provider and user. The environmental assessment approach for sensor systems will be available as a beta-version online tool tentatively from July 2013 onwards. Interested SMEs are invited to get involved as the LCA to go consortium will provide also a comprehensive mentoring for SMEs [less ▲]

Detailed reference viewed: 58 (5 ULg)
See detailMEMS packaging is crucial for system performance and reliability
Saint-Mard, Michel; Stoukatch, Serguei ULg

Scientific conference (2012, March 27)

Detailed reference viewed: 18 (5 ULg)
See detailIC and Microsystem Micro-assembly and Packaging
Stoukatch, Serguei ULg; Saint-Mard, Michel

Scientific conference (2010, March 18)

Detailed reference viewed: 16 (0 ULg)
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See detailSmart Sensors and MEMS for all over Industrial Application Niches
Saint-Mard, Michel ULg; Heusdens, Bruno ULg; Haudry, Fabrice ULg et al

in Smart Systems Integration (2009)

Detailed reference viewed: 77 (10 ULg)
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See detailHigh Vibration Sensors: Modelling, Design and Integration
Rochus, Véronique ULg; Gutschmidt, Stefanie; Golinval, Jean-Claude ULg et al

in Proceedings of Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-systems EuroSime (2009)

Since many years, the University of Liège is involved in micro-electronics and microelectromechanical systems modelling, design and integration. Recently, the University of Liege had received the ... [more ▼]

Since many years, the University of Liège is involved in micro-electronics and microelectromechanical systems modelling, design and integration. Recently, the University of Liege had received the opportunity to build a brand new infrastructure (clean rooms – ISO 7) with specific equipments for packaging and MEMS characterisation. This new facility (clean rooms and equipments) enables the University to be very well positioned in the nano/micro-electronics modelling, analysis and packaging world and is now able to answer specific research and related industrial needs. In this paper we consider the design of a vibration sensor in its significantly vibrating surroundings and investigate in its dynamical behaviour. Environmental vibrations affect the sensor part of the MEMS device and influence the choice of the “best” packaging methods for the application. Within the framework of packaging, we consider a simple test application ensuring best interconnection technology. Dynamical investigations include a preliminary analysis of the packaging and a separate finite-element analysis of the MEMS device (inside the package), testing the device under the condition of a harsh environment (high vibration spectral level). Computations are proposed in combination with experimental observations. [less ▲]

Detailed reference viewed: 77 (14 ULg)