Reference : Selective Area Growth of InP in Shallow-Trench-Isolated Structures on Off-Axis Si(001...
Scientific journals : Article
Engineering, computing & technology : Electrical & electronics engineering
http://hdl.handle.net/2268/72873
Selective Area Growth of InP in Shallow-Trench-Isolated Structures on Off-Axis Si(001) Substrates
English
Wang, Gang [IMEC > > > >]
Leys, Maarten [IMEC > > > >]
Nguyen, Ngoc Duy mailto [Université de Liège - ULg > Département de physique > Physique des solides, interfaces et nanostructures > >]
Loo, Roger [IMEC > > > >]
Brammertz, Guy [IMEC > > > >]
Richard, Olivier [IMEC > > > >]
Bender, Hugo [IMEC > > > >]
Dekoster, Johan [IMEC > > > >]
Meuris, Marc [IMEC > > > >]
Heyns, Marc [Katholieke Universiteit Leuven - KUL and IMEC > Department of Metallurgy and Materials Engineering > > >]
Caymax, Matty [IMEC > > > >]
Sep-2010
Journal of the Electrochemical Society
Electrochemical Society
157
11
H1023
Yes (verified by ORBi)
International
0013-4651
Pennington
USA
[en] Selective area growth ; InP ; Shallow trench isolation ; Si substrate
[en] In this paper, we report a comprehensive investigation of InP selective growth in shallow trench isolation (STI) structures on Si(001) substrates 6° off-cut toward (111). Extended defect-free InP layers were obtained in the top region of 100 nm wide trenches. A thin Ge epitaxial layer was used as an intermediate buffer layer between the Si substrate and the InP layer. A Ge buffer was used to reduce the thermal budget for surface clean and to promote double-step formation on the surfaces. Baking the Ge surface in an As ambient improved the InP surface morphology and crystalline quality. InP showed highly selective growth in trenches without nucleation on SiO2. However, strong loading effects were observed at all growth pressures, which induced variation in local growth rates. We found trench orientation dependence of facet and stacking fault formation. More stacking faults and nanotwins originated from the STI sidewalls in (110) trenches. High quality InP layers were obtained in the top of the trenches along (110). The stacking faults generated by the dissociation of threading dislocations are trapped at the bottom of the trenches with an aspect ratio greater than 2.
Researchers ; Professionals
http://hdl.handle.net/2268/72873
10.1149/1.3489355
http://www.electrochem.org/dl/support/assets/crtf.pdf

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