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Patent (Patents)
Method for manufacturing a junction
Nguyen, Ngoc Duy; Loo, Roger; Caymax, Matty
2012
 

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US 2010 0167446 A1.pdf
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PA 2008119_EPREG1 2017 10 25 EP 2202784 B1 1413167.pdf
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EP 2202784 A2.pdf
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Keywords :
Junction; Atomic layer epitaxy; Epitaxial growth; Bipolar transistor; Vapor phase doping; Atomic layer doping; BiCMOS
Abstract :
[en] The present invention relates to a semiconductor device comprising a homojunction or a heterojunction with a controlled dopant (concentration) profile and a method of making the same. Accordingly, one aspect of the invention is a method for manufacturing a junction comprising forming a first semiconductor material comprising a first dopant having a first concentration and thereupon forming a second semiconductor material comprising a second dopant, having a second concentration thereby forming a junction, and depositing by Atomic Layer Epitaxy or Vapor Phase Doping at least a fraction of a monolayer of a precursor suitable to form the second dopant on the first semiconductor material, prior to forming the second semiconductor material, thereby increasing the second concentration of the second dopant at the junction.
Disciplines :
Electrical & electronics engineering
Inventor :
Nguyen, Ngoc Duy  ;  IMEC
Loo, Roger;  IMEC
Caymax, Matty;  IMEC
Language :
English
Title (54) :
Method for manufacturing a junction
Alternative titles :
[fr] Méthode de fabrication d'une jonction
Publication date (43-45) :
17 April 2012
Filing date (22) :
28 December 2009
Patent/publication number (10-11) :
US 8158451 B2, EP 2 202 784 B1
Patent status (13) :
B
Priority number (30) :
61/141, 197 US 29.12.2008
International classification (IPC) (51) :
H01L 21/20, H01L 21/331, H01L 21/8228, H01L 31/18
European classification (ECLA) (52) :
tbd
Applicant (71) :
IMEC, Leuven (Belgium)
Publication organism (19) :
McDonnell Boehnen Hulbert & Berghoff LLP
Available on ORBi :
since 13 August 2010

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