Reference : Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junction...
Scientific journals : Article
Engineering, computing & technology : Electrical & electronics engineering
http://hdl.handle.net/2268/68760
Use of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology
English
Nguyen, Ngoc Duy mailto [IMEC > > > >]
Rosseel, Erik [IMEC > > > >]
Takeuchi, Shotaro [IMEC > > > >]
Everaert, Jean-Luc [IMEC > > > >]
Yang, Lijun [IMEC > > > >]
Goossens, Jozefien [IMEC > > > >]
Moussa, Alain [IMEC > > > >]
Clarysse, Trudo [IMEC > > > >]
Richard, Olivier [IMEC > > > >]
Bender, Hugo [IMEC > > > >]
Zaima, Shigeaki [University of Nagoya > Department of Crystalline Materials Science, Graduate School of Engineering, > > >]
Sakai, Akira [University of Nagoya > Department of System Innovation, Graduate School of Engineering Science > > >]
Loo, Roger [IMEC > > > >]
Lin, J. C. [TSMC > R&D > > >]
Vandervorst, Wilfried [IMEC > > > >]
Caymax, Matty [IMEC > > > >]
2009
Thin Solid Films
Elsevier Science
518
6
S48
Yes (verified by ORBi)
International
0040-6090
[en] Vapor phase doping ; Atomic layer epitaxy ; Electrical activation ; Conformal doping ; Heavy doping ; Ultra shallow junction ; Laser anneal
[en] We evaluated the combination of vapor phase doping and sub-melt laser anneal as a novel doping strategy for the fabrication of source and drain extension junctions in sub-32 nm CMOS technology, aiming at both planar and non-planar device applications. High quality ultra shallow junctions with abrupt profiles in Si substrates were demonstrated on 300 mm Si substrates. The excellent results obtained for the sheet resistance and the junction depth with boron allowed us to fulfill the requirements for the 32 nm as well as for the 22 nm technology nodes in the PMOS case by choosing appropriate laser anneal conditions. For instance, using 3 laser scans at 1300 $\,^ rc$C, we measured an active dopant concentration of about 2.1 × 1020 cm− 3 and a junction depth of 12 nm. With arsenic for NMOS, ultra shallow junctions were achieved as well. However, as also seen for other junction fabrication schemes, low dopant activation level and active dose (in the range of 1--4 × 1013 cm− 2) were observed although dopant concentration versus depth profiles indicate that the dopant atoms were properly driven into the substrate during the anneal step. The electrical deactivation of a large part of the in-diffused dopants was responsible for the high sheet resistance values.
Researchers ; Professionals
http://hdl.handle.net/2268/68760
10.1016/j.tsf.2009.10.053

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