ORBi: Lemaire Etienne - Microbeam pull-in voltage topology optimization including material deposition constraint

Reference : Microbeam pull-in voltage topology optimization including material deposition constraint


	Document type :	Scientific journals : Article
	Discipline(s) :	Engineering, computing & technology : Electrical & electronics engineering Engineering, computing & technology : Aerospace & aeronautics engineering Engineering, computing & technology : Mechanical engineering Engineering, computing & technology : Multidisciplinary, general & others
	To cite this reference:	http://hdl.handle.net/2268/6554

Title :	Microbeam pull-in voltage topology optimization including material deposition constraint
Language :	English
Author, co-author :	Lemaire, Etienne [Université de Liège - ULg > Département d'aérospatiale et mécanique > Ingénierie des véhicules terrestres > >]
	Rochus, Véronique [Université de Liège - ULg > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures >]
	Golinval, Jean-Claude [Université de Liège - ULg > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures >]
	Duysinx, Pierre [Université de Liège - ULg > Département d'aérospatiale et mécanique > Ingénierie des véhicules terrestres >]
Publication date :	2008
Journal title :	Computer Methods in Applied Mechanics & Engineering
Publisher :	Elsevier Science
Volume :	197
Pages :	4040-4050
Audience :	International
ISSN :	0045-7825
City :	Lausanne
Country :	Switzerland
Keywords :	[en] Topology optimization ; Electromechanical coupling ; Pull-in ; Manufacturing constraint
Abstract :	[en] Because of the strong coupling between mechanical and electrical phenomena existing in electromechanical microdevices, some of them experience, above a given driving voltage, an unstable behavior called pull-in effect. The present paper investigates the application of topology optimization to electromechanical microdevices for the purpose of delaying this unstable behavior by maximizing their pull-in voltage. Within the framework of this preliminary study, the pull-in voltage maximization procedure is developed on the basis of electromechanical microbeams reinforcement topology design problem. The proposed sensitivity analysis requires only the knowledge of the microdevice pull-in state and of the first eigenmode of the tangent stiffness matrix. As the pull-in point research is a highly non-linear problem, the analysis is based on a monolithic finite element formulation combined with a normal flow algorithm (homotopy method). An application of the developed method is proposed and the result is compared to the one obtained using a linear compliance optimization. Moreover, as the results provided by the developed method do not comply with manufacturing constraints, a deposition process constraint is added to the optimization problem and its effect on the final design is also tested.
Funders :	Communauté française de Belgique - CfB
Name of the research project :	ARC03/08-298 "Modeling, Multiphysics Simulation and Optimization of Coupled Problems - Application to Micro Electro-Mechanical Systems"
Permalink :	http://hdl.handle.net/2268/6554

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