Reference : Aging process of electrical contacts in granular matter
Scientific journals : Article
Physical, chemical, mathematical & earth Sciences : Physics
http://hdl.handle.net/2268/34930
Aging process of electrical contacts in granular matter
English
Dorbolo, Stéphane mailto [Université de Liège - ULg > Département de physique > Physique statistique >]
Ausloos, Marcel mailto [Université de Liège - ULg > Département de physique > Physique statistique appliquée et des matériaux >]
Vandewalle, Nicolas mailto [Université de Liège - ULg > Département de physique > Physique statistique >]
Houssa, M. [> > > >]
15-Dec-2003
Journal of Applied Physics
Amer Inst Physics
94
12
7835-7838
Yes (verified by ORBi)
International
0021-8979
Melville
[en] The electrical resistance decay of a metallic granular packing has been measured as a function of time. This measurement gives information about the size of the conducting cluster formed by the well connected grains. Several regimes have been encountered. Chronologically, the first one concerns the growth of the conducting cluster and is identified to belong to diffusion processes through a stretched exponential behavior. The relaxation time is found to be simply related to the initial injected power. This regime is followed by a reorganization process due to thermal dilatation. For the long-term behavior of the decay, an aging process occurs and enhances the electrical contacts between grains through microsoldering. (C) 2003 American Institute of Physics.
http://hdl.handle.net/2268/34930

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