Article (Scientific journals)
Aging process of electrical contacts in granular matter
Dorbolo, Stéphane; Ausloos, Marcel; Vandewalle, Nicolas et al.
2003In Journal of Applied Physics, 94 (12), p. 7835-7838
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Abstract :
[en] The electrical resistance decay of a metallic granular packing has been measured as a function of time. This measurement gives information about the size of the conducting cluster formed by the well connected grains. Several regimes have been encountered. Chronologically, the first one concerns the growth of the conducting cluster and is identified to belong to diffusion processes through a stretched exponential behavior. The relaxation time is found to be simply related to the initial injected power. This regime is followed by a reorganization process due to thermal dilatation. For the long-term behavior of the decay, an aging process occurs and enhances the electrical contacts between grains through microsoldering. (C) 2003 American Institute of Physics.
Disciplines :
Physics
Author, co-author :
Dorbolo, Stéphane  ;  Université de Liège - ULiège > Département de physique > Physique statistique
Ausloos, Marcel ;  Université de Liège - ULiège > Département de physique > Physique statistique appliquée et des matériaux
Vandewalle, Nicolas  ;  Université de Liège - ULiège > Département de physique > Physique statistique
Houssa, M.
Language :
English
Title :
Aging process of electrical contacts in granular matter
Publication date :
15 December 2003
Journal title :
Journal of Applied Physics
ISSN :
0021-8979
eISSN :
1089-7550
Publisher :
Amer Inst Physics, Melville, United States - New York
Volume :
94
Issue :
12
Pages :
7835-7838
Peer reviewed :
Peer Reviewed verified by ORBi
Available on ORBi :
since 24 February 2010

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