ORBi: Rochus Véronique - High Vibration Sensors: Modelling, Design and Integration

Reference : High Vibration Sensors: Modelling, Design and Integration


	Document type :	Scientific congresses and symposiums : Paper published in a book
	Discipline(s) :	Engineering, computing & technology : Mechanical engineering
	To cite this reference:	http://hdl.handle.net/2268/31204

Title :	High Vibration Sensors: Modelling, Design and Integration
Language :	English
Author, co-author :	Rochus, Véronique [Université de Liège - ULg > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures >]
	Gutschmidt, Stefanie [ > > ]
	Golinval, Jean-Claude [Université de Liège - ULg > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures >]
	Saint-Mard, Michel [Université de Liège - ULg > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Dép. d'électric., électron. et informat. (Inst.Montefiore) >]
	Heusdens, Bruno [Université de Liège - ULg > > Interface Entreprises-Université >]
	Haudry, Fabrice [Université de Liège - ULg > > Interface Entreprises-Université >]
	Destiné, Jacques [Université de Liège - ULg > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Electronique, microsystèmes, mesures et instrumentation >]
Publication date :	2009
Main document title :	Proceedings of Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-systems EuroSime
On invitation :	Yes
Audience :	International
Event name :	Proceedings of Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-systems EuroSime
Event place (city) :	Delft
Event country :	The Netherlands
Abstract :	[en] Since many years, the University of Liège is involved in micro-electronics and microelectromechanical systems modelling, design and integration. Recently, the University of Liege had received the opportunity to build a brand new infrastructure (clean rooms – ISO 7) with specific equipments for packaging and MEMS characterisation. This new facility (clean rooms and equipments) enables the University to be very well positioned in the nano/micro-electronics modelling, analysis and packaging world and is now able to answer specific research and related industrial needs. In this paper we consider the design of a vibration sensor in its significantly vibrating surroundings and investigate in its dynamical behaviour. Environmental vibrations affect the sensor part of the MEMS device and influence the choice of the “best” packaging methods for the application. Within the framework of packaging, we consider a simple test application ensuring best interconnection technology. Dynamical investigations include a preliminary analysis of the packaging and a separate finite-element analysis of the MEMS device (inside the package), testing the device under the condition of a harsh environment (high vibration spectral level). Computations are proposed in combination with experimental observations.
Funders :	Fonds de la Recherche Scientifique (Communauté française de Belgique) - F.R.S.-FNRS
Target :	Researchers
Permalink :	http://hdl.handle.net/2268/31204

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