Reference : High Vibration Sensors: Modelling, Design and Integration
Scientific congresses and symposiums : Paper published in a book
Engineering, computing & technology : Mechanical engineering
http://hdl.handle.net/2268/31204
High Vibration Sensors: Modelling, Design and Integration
English
Rochus, Véronique mailto [Université de Liège - ULg > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures >]
Gutschmidt, Stefanie [ > > ]
Golinval, Jean-Claude mailto [Université de Liège - ULg > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures >]
Saint-Mard, Michel mailto [Université de Liège - ULg > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Dép. d'électric., électron. et informat. (Inst.Montefiore) >]
Heusdens, Bruno mailto [Université de Liège - ULg > > Interface Entreprises-Université >]
Haudry, Fabrice mailto [Université de Liège - ULg > > Interface Entreprises-Université >]
Destiné, Jacques mailto [Université de Liège - ULg > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Electronique, microsystèmes, mesures et instrumentation >]
2009
Proceedings of Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-systems EuroSime
No
Yes
International
Proceedings of Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-systems EuroSime
Delft
The Netherlands
[en] Since many years, the University of Liège is
involved in micro-electronics and microelectromechanical
systems modelling, design and
integration. Recently, the University of Liege had
received the opportunity to build a brand new
infrastructure (clean rooms – ISO 7) with specific
equipments for packaging and MEMS characterisation.
This new facility (clean rooms and equipments)
enables the University to be very well positioned in the
nano/micro-electronics modelling, analysis and
packaging world and is now able to answer specific
research and related industrial needs.
In this paper we consider the design of a vibration
sensor in its significantly vibrating surroundings and
investigate in its dynamical behaviour. Environmental
vibrations affect the sensor part of the MEMS device
and influence the choice of the “best” packaging
methods for the application. Within the framework of
packaging, we consider a simple test application
ensuring best interconnection technology. Dynamical
investigations include a preliminary analysis of the
packaging and a separate finite-element analysis of the
MEMS device (inside the package), testing the device
under the condition of a harsh environment (high
vibration spectral level). Computations are proposed in
combination with experimental observations.
Fonds de la Recherche Scientifique (Communauté française de Belgique) - F.R.S.-FNRS
Researchers
http://hdl.handle.net/2268/31204

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