| Reference : Prediction of Stiction in Microswitch Systems |
| Scientific congresses and symposiums : Paper published in a book | |||
| Engineering, computing & technology : Mechanical engineering Engineering, computing & technology : Materials science & engineering | |||
| http://hdl.handle.net/2268/22181 | |||
| Prediction of Stiction in Microswitch Systems | |
| English | |
Wu, Ling [Université de Liège - ULG > Département d'Aérospatiale et Mécanique > LTAS - Vibrations > >] | |
Rochus, Véronique [Université de Liège - ULg > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures >] | |
Noels, Ludovic [Université de Liège - ULg > Département d'aérospatiale et mécanique > Computational & Multiscale Mechanics of Materials (CM3) >] | |
Golinval, Jean-Claude [Université de Liège - ULg > Département d'aérospatiale et mécanique > LTAS - Vibrations et identification des structures >] | |
| 2010 | |
| EUROSIME 2010 | |
| Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on | |
| 4 pages | |
| No | |
| No | |
| International | |
| 978-1-4244-7026-6 | |
| EuroSimE 2010 | |
| April 26 -28, 2010 | |
| Bordeaux | |
| France | |
| [en] Stiction is a major failure mode of MEMS as microscopic structures tend to adhere to each other when their surfaces enter into contact. Although increasing the restoring forces of switch devices could overcome the stiction effect, this is not practical, as in turn, it also
increases the actuation voltage. Therefore stiction prediction is important to be considered when designing micro- and nano- devices. In this paper, the numerical prediction of stiction for capacitive MEMS switches is considered. Toward this end, a micro-adhesive-contact law is derived from previous work and combined with a finite-element model. | |
| Fonds de la Recherche Scientifique (Communauté française de Belgique) - F.R.S.-FNRS | |
| Researchers ; Professionals ; Students | |
| http://hdl.handle.net/2268/22181 | |
| 10.1109/ESIME.2010.5464599 | |
| http://dx.doi.org/10.1109/ESIME.2010.5464599 | |
| 2010 (c) IEEE |
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