Article (Scientific journals)
An investigation of structural dimension variation in electrostatically-coupled MEMS resonator pairs using mode-localization
Wood, Graham; Chun, Zhao; Pu, Suan et al.
2016In IEEE Sensors Journal
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Abstract :
[en] If a pair of MEMS resonators are electrostatically coupled together, the vibration amplitude ratios at the resonant frequencies of the resulting coupled system are sensitive to stiffness perturbation. An imbalance between the two resonators causes the confinement of vibration energy when the system is resonating, an effect known as mode-localization. The degree of localization can be determined by extracting the amplitude ratio of the resonators through capacitive transduction. In this paper, we have fabricated MEMS devices, using a dicing-free silicon-on-insulator process, consisting of pairs of closely spaced microresonators. Each resonator consists of a clamped-clamped beam with a wider section in the middle, which is the location of the electrostatic coupling, instituted through the DC biasing of the resonators. Several devices have been fabricated, with the length of the anchor beams being varied, which influences the frequency of resonance. Stiffness imbalance between the resonators has been introduced through electrostatic spring softening, with the sensitivity of the amplitude ratio of the resonant mode shape being greater for the higher frequency, shorter anchor devices. The sensitivities of the devices in this study have been found to be 9 times greater than state-of-the-art two-degree-of-freedom mode-localized sensors.
Disciplines :
Electrical & electronics engineering
Author, co-author :
Wood, Graham
Chun, Zhao
Pu, Suan
Boden, Stuart
Sari
Kraft, Michael ;  Université de Liège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Language :
English
Title :
An investigation of structural dimension variation in electrostatically-coupled MEMS resonator pairs using mode-localization
Publication date :
2016
Journal title :
IEEE Sensors Journal
ISSN :
1530-437X
eISSN :
1558-1748
Publisher :
Institute of Electrical and Electronics Engineers, New York, United States - New York
Peer reviewed :
Peer Reviewed verified by ORBi
Available on ORBi :
since 08 July 2016

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