Realization of electroplating molds with thick positive SPR 220-7 photoresist

Kukharenka, Elena; Kraft, Michael

doi:10.1023/A:1023923911921

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Article (Scientific journals)

Realization of electroplating molds with thick positive SPR 220-7 photoresist

Kukharenka, Elena; Kraft, Michael

2003 • In Journal of Materials Science: Materials in Electronics, 14 (5-7), p. 319-322

Peer Reviewed verified by ORBi

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https://hdl.handle.net/2268/200008

DOI
10.1023/A:1023923911921

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Disciplines :

Electrical & electronics engineering

Author, co-author :

Kukharenka, Elena

Kraft, Michael ; Université de Liège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Language :

English

Title :

Realization of electroplating molds with thick positive SPR 220-7 photoresist

Publication date :

2003

Journal title :

Journal of Materials Science: Materials in Electronics

ISSN :

0957-4522

eISSN :

1573-482X

Publisher :

Kluwer Academic Publishers, Netherlands

Volume :

Issue :

5-7

Pages :

319-322

Peer reviewed :

Peer Reviewed verified by ORBi

Additional URL :

http://link.springer.com/article/10.1023\%2FA\%3A1023923911921

Available on ORBi :

since 08 July 2016

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Bibliography

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P. Folman Kruger, D. Cassettari, B. Hessmo, T. Maier and J. Schmiedmayer, Phys. Rev. Lett. 48 (2000) 20, 47.
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L. Guerin, A. Torosdagi, P. Eichenberger and P. Renaud, Proc. Eurosensors (1998) 11.
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