microassembly and packaging; low temperature processing; integration
Abstract :
[en] Microassembly and packaging in a broad sense is a technique that interconnects
microelectronics into a system level to form a functional product for the end user.
Microassembly and packaging provide electrical and mechanical interconnection between
microelectronics and the package.
Disciplines :
Electrical & electronics engineering
Author, co-author :
Stoukatch, Serguei ; Université de Liège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Language :
English
Title :
Chapter 2. Low-Temperature Microassembly Methods and Integration Techniques for Biomedical Applications
