Nanoprecision alignment for wafer bonding

Jiang, Liudi; Pandraud, Gregory; French, Paddy James; Spearing, S. Mark; Kraft, Michaël

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Nanoprecision alignment for wafer bonding

Jiang, Liudi; Pandraud, Gregory; French, Paddy James et al.

2006 • In The 17th Micromechanics Europe Workshop, MME'06

Peer reviewed

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https://hdl.handle.net/2268/192159

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Disciplines :

Electrical & electronics engineering

Author, co-author :

Jiang, Liudi

Pandraud, Gregory

French, Paddy James

Spearing, S. Mark

Kraft, Michaël ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés

Language :

English

Title :

Nanoprecision alignment for wafer bonding

Publication date :

September 2006

Event name :

Proc. MME 2006 Conference

Event place :

United Kingdom

Event date :

September 2006

By request :

Yes

Audience :

International

Main work title :

The 17th Micromechanics Europe Workshop, MME'06

Pages :

pp.101-104

Peer reviewed :

Peer reviewed

Commentary :

101--104

Available on ORBi :

since 25 January 2016

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