IC and Microsystem Micro-assembly and  Packaging

Stoukatch, Serguei; Saint-Mard, Michel

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Scientific conference in universities or research centers (Scientific conferences in universities or research centers)

IC and Microsystem Micro-assembly and Packaging

Stoukatch, Serguei; Saint-Mard, Michel

2010

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https://hdl.handle.net/2268/169735

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Keywords :

microassembly; IC and Microsystem packaging; Integration and interconnection technology

Disciplines :

Electrical & electronics engineering

Author, co-author :

Stoukatch, Serguei ; Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Electronique, microsystèmes, mesures et instrumentation

Saint-Mard, Michel

Language :

English

Title :

IC and Microsystem Micro-assembly and Packaging

Publication date :

18 March 2010

Event name :

Technical event on IC and Microsystem Micro Packaging

Event organizer :

Microsys, ULg and Taipro Engineering

Event place :

Liege, Belgium

Event date :

18-03-2010

Available on ORBi :

since 30 June 2014

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