Reference : Cu doping as a tool for understanding CMR
Scientific congresses and symposiums : Paper published in a journal
Engineering, computing & technology : Materials science & engineering
http://hdl.handle.net/2268/12602
Cu doping as a tool for understanding CMR
English
Vertruyen, Bénédicte mailto [Université de Liège - ULg > Département de chimie (sciences) > Chimie inorganique structurale >]
Cloots, Rudi [Université de Liège - ULg > Département de chimie (sciences) > Chimie inorganique structurale - Doyen de la Faculté des Sciences >]
Rulmont, André [Université de Liège - ULg > Département de chimie (sciences) > Département de chimie (sciences) >]
Dorbolo, Stéphane mailto [Université de Liège - ULg > Département de physique > Physique statistique >]
Vanderbemden, Philippe mailto [Université de Liège - ULg > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Capteurs et systèmes de mesures électriques >]
Ausloos, Marcel [Université de Liège - ULg > Département de physique > Physique statistique appliquée et des matériaux - S.U.P.R.A.S. >]
2002
Key Engineering Materials [=KEM]
206-2
Euro Ceramics Vii, Pt 1-3
1453-1456
No
International
1013-9826
[en] manganates ; colossal magnetoresistance ; double exchange ; Mn-site doping ; resistivity ; electroceramics
[en] Doping at the Mn-site in CMR manganate-based perovskites has been shown to affect strongly the physical properties of those compounds. We study here the effect of copper substitution in the low doping range on the electrical transport properties of La0.7Ca0.3MnO3. It turns out that the transition temperature decrease observed in doped samples can be drastically reduced by addition of silicon dioxide SiO2. It is shown that copper is trapped in a secondary phase composed of La,Ca,Si,Cu and O. The resultant Mn-site vacancies appear to be less detrimental to the electronic conduction than the likely antiferromagnetic clusters induced by the copper ions in the Mn-O network.
Fonds de la Recherche Scientifique (Communauté française de Belgique) - F.R.S.-FNRS
Researchers ; Professionals
http://hdl.handle.net/2268/12602
The following article appeared in Key Engineering Materials and may be found at http://www.scientific.net/KEM/

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