References of "Moussa, Alain"
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See detailElectrical Activity of Threading Dislocations and Defect Complexes in GeSn Epitaxial Layers
Gupta, Somya; Simoen, Eddy; Asano, Takanori et al

Conference (2013, June 04)

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See detailN-type and p-type ultra shallow junctions by atomic layer epitaxy and laser anneal
Nguyen, Ngoc Duy ULg; Souriau, Laurent; Shimizu, Yasuo et al

Conference (2011)

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See detailUse of p- and n-type vapor phase doping and sub-melt laser anneal for extension junctions in sub-32 nm CMOS technology
Nguyen, Ngoc Duy ULg; Rosseel, Erik; Takeuchi, Shotaro et al

in Thin Solid Films (2009), 518(6), 48

We evaluated the combination of vapor phase doping and sub-melt laser anneal as a novel doping strategy for the fabrication of source and drain extension junctions in sub-32 nm CMOS technology, aiming at ... [more ▼]

We evaluated the combination of vapor phase doping and sub-melt laser anneal as a novel doping strategy for the fabrication of source and drain extension junctions in sub-32 nm CMOS technology, aiming at both planar and non-planar device applications. High quality ultra shallow junctions with abrupt profiles in Si substrates were demonstrated on 300 mm Si substrates. The excellent results obtained for the sheet resistance and the junction depth with boron allowed us to fulfill the requirements for the 32 nm as well as for the 22 nm technology nodes in the PMOS case by choosing appropriate laser anneal conditions. For instance, using 3 laser scans at 1300 $\,^ rc$C, we measured an active dopant concentration of about 2.1 × 1020 cm− 3 and a junction depth of 12 nm. With arsenic for NMOS, ultra shallow junctions were achieved as well. However, as also seen for other junction fabrication schemes, low dopant activation level and active dose (in the range of 1--4 × 1013 cm− 2) were observed although dopant concentration versus depth profiles indicate that the dopant atoms were properly driven into the substrate during the anneal step. The electrical deactivation of a large part of the in-diffused dopants was responsible for the high sheet resistance values. [less ▲]

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See detailVapor phase doping and sub-melt laser anneal for the fabrication of Si-based ultra-shallow junctions in sub-32 nm CMOS technology
Nguyen, Ngoc Duy ULg; Rosseel, Erik; Takeuchi, Shotaro et al

in International Semiconductor Device Research Symposium, 2009 (2009)

The authors demonstrated that the combination of VPD and LA enables the fabrication of high quality, defect-free USJs with abrupt dopant profile. The results for PMOS with B-VPD are very promising for the ... [more ▼]

The authors demonstrated that the combination of VPD and LA enables the fabrication of high quality, defect-free USJs with abrupt dopant profile. The results for PMOS with B-VPD are very promising for the 32 nm and the 22 nm technology nodes. In the case of NMOS, As-VPD and LA enable the fabrication of an USJ but the electrical deactivation of a large part of the in-diffused dopants is responsible for the high sheet resistance values. [less ▲]

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See detailVapor phase doping and sub-melt laser anneal for ultra-shallow extension junctions in sub-32 nm CMOS technology
Nguyen, Ngoc Duy ULg; Rosseel, Erik; Takeuchi, Shotaro et al

in Chiussi, S.; Alpuim, P.; Murota, J. (Eds.) et al SiNEP 2009. 1st International Workshop on Si based nano-electronics and -photonics (2009)

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