TiO2 multilayer thick films (up to 4 μm) with ordered mesoporosity: Influence of template on the film mesostructure and use as high efficiency photoelectrode in DSSCs

in Journal of Materials Chemistry (2011), 21(20), 7356-7363

Mesoporous templated anatase thin films are very promising materials to act as photoelectrode in dye-sensitized solar cell. Templated-assisted dip-coating techniques are used to obtain thin films with ... [more ▼]

Mesoporous templated anatase thin films are very promising materials to act as photoelectrode in dye-sensitized solar cell. Templated-assisted dip-coating techniques are used to obtain thin films with ordered porosity. However, monolayer films are very thin and suffer from a low quantity of active material, leading to poor photovoltaic performances. In this paper, a dip-coating-based multilayer deposition technique is reported. First, we have studied the influence of the template on the film organization and porosity in terms of long-range order, percentage of porosity, pore size and pores connectivity. Different techniques such as transmission electron microscopy (TEM), atmospheric poroellipsometry (AEP) and UV-visible absorption spectroscopy (UV-vis.) have been used to describe the microstructural features of the films with a thickness of 1 µm. The film exhibiting the highest dye loading was selected and its thickness gradually increased up to 4 µm. Finally, the photovoltaic performances of the thick films (1 to 4 µm) have been evaluated in combination with the N-719 dye and show excellent efficiency (6.1%) when compared to values reported in the literature. Such mesostructured films are compared in terms of photovoltaic performance with TiO2 nanoparticles films, generally used in DSSC. [less ▲]

Characterization and impact of reduced copper plating overburden on 45 nm interconnect performances

in Microelectronic Engineering (2010, March), 87(3),

During first metal level interconnects fabrication, a controlled modification of the electro-deposited copper over-deposition (overburden) is performed using a partial chemical–mechanical polishing (CMP ... [more ▼]

During first metal level interconnects fabrication, a controlled modification of the electro-deposited copper over-deposition (overburden) is performed using a partial chemical–mechanical polishing (CMP) step. Next, copper microstructure is stabilized with a short duration hot-plate anneal. Overburden is then removed during CMP end-of-step. Ionic microscopy and EBSD observations of overburden thickness reduction reveal that copper grain growth occurs differently, according to patterned geometries and with a strong (1 1 1) texture, as observed in modified films. Reduction of overburden thickness also reveals the capacity of anneal temperature to impact electrical performances. Reliability is impacted for thinnest wires. [less ▲]

Characterization of copper grain growth limitations inside narrow wires depending of overburden thickness

in Microelectronic Engineering (2008, October), 85(10), 1988-1991

With the downscaling of feature dimensions, copper interconnects exhibit properties differing from bulk or film material. Resistivity increases and limits electrical performances, and reliability of ... [more ▼]

With the downscaling of feature dimensions, copper interconnects exhibit properties differing from bulk or film material. Resistivity increases and limits electrical performances, and reliability of interconnects becomes a more important challenge for each new technological node. In this study, we present an approach of copper grain growth control inside narrow wires by adding a step between the copper electro-chemical deposition (ECD) and the chemical–mechanical polishing (CMP). This step corresponds to a partial CMP step (pre-CMP) and is applied after ECD and before anneal in order to modify the copper previous termoverburdennext term thickness. Depending on the targeted thickness, copper grain growth occurs during anneal with different efficiencies. Crystallization and grain growth behavior inside wires is investigated with focused ions beam (FIB). We present here our methodology for sample preparation and characterization. Results are focused on electrical variations and on morphological aspects of copper crystallization and grain growth inside lines observed with various overburden thicknesses. [less ▲]